PROCESSING METHOD AND PROCESSING SYSTEM

Abstract: a processing method of a combined substrate in which a first substrate and a second substrate are bonded to each other includes acquiring an eccentric amount between the first substrate and the second substrate; forming, by radiating internal laser light along a boundary between a peripheral portion of the first substrate and a central portion of the first substrate, a peripheral modification layer serving as a starting point of separation of the peripheral portion; and removing the peripheral portion starting from the peripheral modification layer. in the forming of the peripheral modification layer, an irradiation position of the internal laser light is determined based on the eccentric amount.

Inventor(s): Yohei YAMASHITA

CPC Classification: B23K26/53 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal ; building up linings or coverings by casting ; casting by dipping ; manufacture of composite layers by sintering metal powder ; arrangements on machine tools for copying or controlling ; covering metals or covering materials with metals, not otherwise provided for ; burners ))

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