20240013979. STACKED CERAMIC CAPACITOR PACKAGE FOR ELECTRONIC DEVICE simplified abstract (AMOTECH CO., LTD.)

STACKED CERAMIC CAPACITOR PACKAGE FOR ELECTRONIC DEVICE

Organization Name

AMOTECH CO., LTD.

Inventor(s)

Yugyeong Gu of Incheon (KR)

Jaewook Lee of Incheon (KR)

STACKED CERAMIC CAPACITOR PACKAGE FOR ELECTRONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240013979 titled 'STACKED CERAMIC CAPACITOR PACKAGE FOR ELECTRONIC DEVICE

Simplified Explanation

The abstract describes a stacked ceramic capacitor package for an electronic device that prevents noise, vibration, and cracks caused by piezoelectric properties. The package includes stacked ceramic capacitors, a first terminal structure connected to one side of the capacitors, and a second terminal structure connected to the opposite side of the capacitors. The first terminal structure has a groove in the area that contacts the capacitors, with the horizontal length of the groove being 30% to 50% of the horizontal length of the capacitors.

• The patent describes a stacked ceramic capacitor package for electronic devices.
• The package includes stacked ceramic capacitors, a first terminal structure, and a second terminal structure.
• The first terminal structure is connected to one side of the stacked ceramic capacitors.
• The second terminal structure is connected to the opposite side of the stacked ceramic capacitors and faces the first terminal structure.
• The first terminal structure has a groove in the area that contacts the capacitors.
• The horizontal length of the groove is 30% to 50% of the horizontal length of the stacked ceramic capacitors.

Potential applications of this technology:

• Electronic devices that require stacked ceramic capacitors.
• Devices that are sensitive to noise, vibration, and cracks caused by piezoelectric properties.

Problems solved by this technology:

• Noise, vibration, and cracks caused by piezoelectric properties in stacked ceramic capacitor packages.
• Ensuring stable performance and reliability of electronic devices.

Benefits of this technology:

• Prevents noise, vibration, and cracks in electronic devices.
• Improves the performance and reliability of electronic devices.
• Provides a solution for the challenges posed by piezoelectric properties in stacked ceramic capacitors.

Original Abstract Submitted

provided is a stacked ceramic capacitor package, for an electronic device, preventing noise, vibration and cracks due to piezoelectric properties. the ceramic capacitor package for an electronic device comprises: stacked ceramic capacitors; a first terminal structure connected to a first side surface of the stacked ceramic capacitors; and a second terminal structure connected to a second side surface of the stacked ceramic capacitors and disposed so as to face the first terminal structure with the stacked ceramic capacitors therebetween. the first terminal structure has a first groove defined in an area coming into contact with the first side surface of the stacked ceramic capacitors. the horizontal length of the first groove is 30% to 50% of the horizontal length of the stacked ceramic capacitors.