20240011678. SEMICONDUCTOR REFRIGERATION PLATE AND MANUFACTURING METHOD THEREFOR simplified abstract (BYD COMPANY LIMITED)

SEMICONDUCTOR REFRIGERATION PLATE AND MANUFACTURING METHOD THEREFOR

Organization Name

BYD COMPANY LIMITED

Inventor(s)

Yonghui Li of Shenzhen (CN)

Junqiao Li of Shenzhen (CN)

Wei Zhou of Shenzhen (CN)

SEMICONDUCTOR REFRIGERATION PLATE AND MANUFACTURING METHOD THEREFOR - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240011678 titled 'SEMICONDUCTOR REFRIGERATION PLATE AND MANUFACTURING METHOD THEREFOR

Simplified Explanation

The abstract describes a semiconductor refrigeration chip and a method for manufacturing it. The method involves providing a semiconductor refrigeration assembly consisting of two insulating and heat-conducting layers and a semiconductor layer arranged between them. One side of the assembly is the cold end, while the other side is the hot end. A packaging structure is formed to cover the side wall of the assembly and create a groove with one of the insulating layers, resulting in the semiconductor refrigeration chip.

• The semiconductor refrigeration chip is manufactured by sandwiching a semiconductor layer between two insulating and heat-conducting layers.
• The chip has a cold end and a hot end, with the insulating layers defining these ends.
• A packaging structure is formed to cover the side wall of the chip and create a groove with one of the insulating layers.
• The resulting semiconductor refrigeration chip can be used for cooling applications.

Potential applications of this technology:

• Cooling electronic devices, such as computer processors or power amplifiers.
• Cooling sensors or detectors in scientific instruments.
• Cooling components in medical devices, such as laser systems or imaging equipment.

Problems solved by this technology:

• Efficient cooling of electronic devices or sensitive components.
• Miniaturization of cooling systems.
• Improved thermal management in various applications.

Benefits of this technology:

• Enhanced performance and reliability of electronic devices.
• Compact and lightweight cooling solutions.
• Energy efficiency and reduced power consumption.
• Improved temperature control and stability.

Original Abstract Submitted

a semiconductor refrigeration chip and a method for manufacturing same are provided. the method includes: providing a semiconductor refrigeration assembly, where the semiconductor refrigeration assembly includes a first insulating and heat-conducting layer and a second insulating and heat-conducting layer provided opposite to each other and a semiconductor layer arranged between the first insulating and heat-conducting layer and the second insulating and heat-conducting layer, a side of the semiconductor refrigeration assembly provided with the first insulating and heat-conducting layer is a cold end, and a side of the semiconductor refrigeration assembly provided with the second insulating and heat-conducting layer is a hot end; and forming a packaging structure, and causing the packaging structure to cover a side wall of the semiconductor refrigeration assembly and define a first groove with the first insulating and heat-conducting layer, to obtain the semiconductor refrigeration chip.