19016598. HOUSINGS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
HOUSINGS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
Organization Name
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor(s)
HOUSINGS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
This abstract first appeared for US patent application 19016598 titled 'HOUSINGS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
Original Abstract Submitted
A casing for semiconductor packages that includes a plurality of press-fit pins is disclosed. Specific implementations include a shaft including a first end and a second end. The first end may include a head. The press-fit pin may include a bonding portion included at the second end. The bonding portion may include a first section extending substantially perpendicular from a longest length of the shaft. The bonding portion may also include an angled section coupled to a bonding foot. The bonding foot may be configured to be ultrasonically welded to a substrate.
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