19013290. Assemblies Comprising Memory Cells and Select Gates; and Methods of Forming Assemblies (Micron Technology, Inc.)
Assemblies Comprising Memory Cells and Select Gates; and Methods of Forming Assemblies
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Assemblies Comprising Memory Cells and Select Gates; and Methods of Forming Assemblies
This abstract first appeared for US patent application 19013290 titled 'Assemblies Comprising Memory Cells and Select Gates; and Methods of Forming Assemblies
Original Abstract Submitted
Some embodiments include an assembly having a stack of alternating dielectric levels and conductive levels. Channel material pillars extend through the stack. Some of the channel material pillars are associated with a first sub-block, and others of the channel material pillars are associated with a second sub-block. Memory cells are along the channel material pillars. An insulative level is over the stack. A select gate configuration is over the insulative level. The select gate configuration includes a first conductive gate structure associated with the first sub-block, and includes a second conductive gate structure associated with the second sub-block. The first and second conductive gate structures are laterally spaced from one another by an intervening insulative region. The first and second conductive gate structures have vertically-spaced conductive regions, and have vertically-extending conductive structures which electrically couple the vertically-spaced conductive regions to one another. Some embodiments include methods of forming assemblies.