FIBER-TO-CHIP GRATING COUPLER FOR PHOTONIC CIRCUITS

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

FIBER-TO-CHIP GRATING COUPLER FOR PHOTONIC CIRCUITS

This abstract first appeared for US patent application 19012756 titled 'FIBER-TO-CHIP GRATING COUPLER FOR PHOTONIC CIRCUITS

Original Abstract Submitted

Disclosed is a system and method for communication using an efficient fiber-to-chip grating coupler with a high coupling efficiency. In one embodiment, a method for communication, includes: transmitting optical signals between a semiconductor photonic die on a substrate and an optical fiber array attached to the substrate using at least one corresponding grating coupler on the semiconductor photonic die, wherein the at least one grating coupler each comprises a plurality of coupling gratings, a waveguide, a cladding layer, a first reflection layer and a second reflection layer, wherein the plurality of coupling gratings each comprises at least one step in a first lateral direction and extends in a second lateral direction, wherein the first and second lateral directions are parallel to a surface of the substrate and perpendicular to each other in a grating plane, wherein the first reflection layers are configured such that the plurality of coupling gratings is disposed between the first reflection layer and the cladding layer, wherein the second reflection layer are configured such that the cladding layer is disposed between the second reflection layer and the waveguide.