19011366. THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS
Organization Name
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Inventor(s)
Francis J. Carney of Mesa AZ US
THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS
This abstract first appeared for US patent application 19011366 titled 'THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS
Original Abstract Submitted
Implementations of semiconductor packages may include a die having a first side and a second side opposite the first side, a first metal layer coupled to the first side of the die, a tin layer coupled to the first metal layer, the first metal layer between the die and the tin layer, a backside metal layer coupled to the second side of the die, and a mold compound coupled to the die. The mold compound may cover a plurality of sidewalls of the first metal layer and a plurality of sidewalls of the tin layer and a surface of the mold compound is coplanar with a surface of the tin layer.