19010399. ELECTRONIC COMPONENT AND FILM FORMING METHOD (Murata Manufacturing Co., Ltd.)
ELECTRONIC COMPONENT AND FILM FORMING METHOD
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Mitsuru Nakano of Nagaokakyo-shi JP
Hiroshi Shiraki of Nagaokakyo-shi JP
ELECTRONIC COMPONENT AND FILM FORMING METHOD
This abstract first appeared for US patent application 19010399 titled 'ELECTRONIC COMPONENT AND FILM FORMING METHOD
Original Abstract Submitted
An electronic component includes a base body and an alumina film covering an outer surface of the base body. The alumina film includes a film-shaped part made of alumina and in contact with the outer surface of the base body, and a particle layer located on the outer surface side of the film-shaped part. The particle layer includes a plurality of alumina particles bonded to the outer surface of the film-shaped part. The average value of the thicknesses of the alumina film including the film-shaped part and the particle layer is 0.05 μm or more and 2.0 μm or less. The interval between the particles is 1.3 μm or less.