19007801. SEMICONDUCTOR DEVICE (Kioxia Corporation)

SEMICONDUCTOR DEVICE

Organization Name

Kioxia Corporation

Inventor(s)

Masayoshi Tagami of Kuwana JP

SEMICONDUCTOR DEVICE

This abstract first appeared for US patent application 19007801 titled 'SEMICONDUCTOR DEVICE

Original Abstract Submitted

In one embodiment, a semiconductor device includes a first chip including a substrate, a first plug on the substrate, and a first pad on the first plug, and a second chip including a second plug and a second pad under the second plug. The second chip includes an electrode layer electrically connected to the second plug, a charge storage layer provided on a side face of the electrode layer via a first insulator, and a semiconductor layer provided on a side face of the charge storage layer via a second insulator. The first and second pads are bonded with each other, and the first and second plugs are disposed so that at least a portion of the first plug and at least a portion of the second plug do not overlap with each other in a first direction that is perpendicular to a surface of the substrate.