19005417. IMAGING ELEMENT (Sony Semiconductor Solutions Corporation)
IMAGING ELEMENT
Organization Name
Sony Semiconductor Solutions Corporation
Inventor(s)
Yoshiaki Kitano of Kanagawa JP
Hirofumi Yamashita of Kanagawa JP
IMAGING ELEMENT
This abstract first appeared for US patent application 19005417 titled 'IMAGING ELEMENT
Original Abstract Submitted
An imaging element according to an embodiment of the present disclosure includes: a first substrate, a second substrate, and a third substrate that are stacked in this order. The first substrate including a sensor pixel that performs photoelectric conversion and the second substrate including a readout circuit are electrically coupled to each other by a first through wiring line provided in an interlayer insulating film. The second substrate and the third substrate including a logic circuit are electrically coupled to each other by a junction between pad electrodes or a second through wiring line penetrating through a semiconductor substrate.