19002718. PACKAGE STRUCTURE (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
PACKAGE STRUCTURE
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Yi-Da Tsai of Chiayi Country TW
Sheng-Feng Weng of Taichung City TW
Yu-Hao Chen of HsinChu City TW
Sheng-Hsiang Chiu of Tainan City TW
Chih-Wei Lin of Hsinchu County TW
PACKAGE STRUCTURE
This abstract first appeared for US patent application 19002718 titled 'PACKAGE STRUCTURE
Original Abstract Submitted
A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Kai-Ming Chiang of Hsinchu TW
- Chao-wei Li of Hsinchu TW
- Wei-Lun Tsai of Hsinchu TW
- Chia-Min Lin of Hsinchu TW
- Yi-Da Tsai of Chiayi Country TW
- Sheng-Feng Weng of Taichung City TW
- Yu-Hao Chen of HsinChu City TW
- Sheng-Hsiang Chiu of Tainan City TW
- Chih-Wei Lin of Hsinchu County TW
- Ching-Hua Hsieh of Hsinchu TW
- H01L23/00
- H01L21/48
- H01L21/56
- H01L21/683
- H01L23/31
- H01L23/538
- H01L25/00
- H01L25/065
- CPC H01L23/562