19001356. MEDIUM PROCESSING DEVICE AND LIQUID APPLICATION SYSTEM (FUJIFILM Corporation)
MEDIUM PROCESSING DEVICE AND LIQUID APPLICATION SYSTEM
Organization Name
Inventor(s)
Hayate Nakamura of Kanagawa JP
Takashi Mitsuyasu of Kanagawa JP
MEDIUM PROCESSING DEVICE AND LIQUID APPLICATION SYSTEM
This abstract first appeared for US patent application 19001356 titled 'MEDIUM PROCESSING DEVICE AND LIQUID APPLICATION SYSTEM
Original Abstract Submitted
A medium processing device that suppresses adhesion of a liquid, with improved durability of a member that comes into contact with a medium after a drying treatment. The medium processing device includes: a drying device that performs the drying treatment on a medium; and a contact member that first comes into contact with a liquid adhering surface of the medium, after the drying treatment. The drying device performs the drying treatment so that a mass of a liquid per unit area on a liquid adhering surface of the medium is 200 μg/cmor less. The contact member has a cooling structure. Bonding work of a contact surface that comes into contact with the liquid adhering surface with respect to a liquid applied region of the liquid adhering surface is 80 mN/m or less. Vickers hardness of the contact surface is 450 Hv or more and 600 Hv or less.
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