19001098. CHIP STRUCTURE WITH ETCH STOP LAYER (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
CHIP STRUCTURE WITH ETCH STOP LAYER
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Wei-Li Huang of Pingtung City TW
CHIP STRUCTURE WITH ETCH STOP LAYER
This abstract first appeared for US patent application 19001098 titled 'CHIP STRUCTURE WITH ETCH STOP LAYER
Original Abstract Submitted
A chip structure is provided. The chip structure includes a substrate. The chip structure includes a conductive pad over the substrate. The chip structure includes a passivation layer covering the substrate and exposing the conductive pad. The chip structure includes a first etch stop layer over the passivation layer. The chip structure includes a first buffer layer over the first etch stop layer. The first etch stop layer and the first buffer layer are made of different materials. The chip structure includes a second etch stop layer over the first buffer layer. The second etch stop layer and the first buffer layer are made of different materials.