19000773. CORE MODULES AND ELECTRONIC DEVICES (SHENZHEN SHOKZ CO., LTD.)
CORE MODULES AND ELECTRONIC DEVICES
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CORE MODULES AND ELECTRONIC DEVICES
This abstract first appeared for US patent application 19000773 titled 'CORE MODULES AND ELECTRONIC DEVICES
Original Abstract Submitted
A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, and a vibration panel. The housing component includes a core housing, a core cover plate, and a sealing film. The transducer device includes a support. The core cover plate and the sealing film are respectively provided with a first avoidance hole and a second avoidance hole allowing the vibration panel to be connected with the support. The sealing film is configured to seal an assembly clearance of the first avoidance hole. At least one of the vibration panel and the support is provided with a support end surface corresponding to a surrounding region of the second avoidance hole. The sealing film is fixed on the support end surface.