19000672. CORE MODULES AND ELECTRONIC DEVICES (SHENZHEN SHOKZ CO., LTD.)

CORE MODULES AND ELECTRONIC DEVICES

Organization Name

SHENZHEN SHOKZ CO., LTD.

Inventor(s)

Chaowu Li of Shenzhen CN

Qianwen Nie of Shenzhen CN

CORE MODULES AND ELECTRONIC DEVICES

This abstract first appeared for US patent application 19000672 titled 'CORE MODULES AND ELECTRONIC DEVICES

Original Abstract Submitted

A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, a vibration panel, and a face attachment component. The transducer device is disposed in the housing component. The vibration panel is connected with the transducer device and protrudes a preset distance with respect to the housing component along a vibration direction of the transducer device when the transducer device is in a non-vibration state. The face attachment component includes a face attachment sleeve. The face attachment sleeve includes a central portion, a transition portion connected with the central portion, and a fixed portion connected with the transition portion. The central portion covers the vibration panel. The fixed portion is connected with the housing component. At least the transition portion of the face attachment sleeve is a flexible braided fabric.