19000361. CORE MODULES AND ELECTRONIC DEVICES (SHENZHEN SHOKZ CO., LTD.)
CORE MODULES AND ELECTRONIC DEVICES
Organization Name
Inventor(s)
CORE MODULES AND ELECTRONIC DEVICES
This abstract first appeared for US patent application 19000361 titled 'CORE MODULES AND ELECTRONIC DEVICES
Original Abstract Submitted
A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, a vibration panel, and a face attachment component. The housing component includes a core housing and a core cover plate covering an open end of the core housing. The core cover plate and the core housing cooperate to form a first cavity. The face attachment component and the housing component cooperate to form a second cavity. The transducer device is at least partially located in the first cavity. The vibration panel is at least partially located in the second cavity. The core cover plate is provided with a first avoidance hole allowing the vibration panel to be connected with the transducer device. The core module is provided with a channel connecting the second cavity with the outside of the core module.