19000339. CORE MODULES AND ELECTRONIC DEVICES (SHENZHEN SHOKZ CO., LTD.)

CORE MODULES AND ELECTRONIC DEVICES

Organization Name

SHENZHEN SHOKZ CO., LTD.

Inventor(s)

Chaowu Li of Shenzhen CN

Qianwen Nie of Shenzhen CN

CORE MODULES AND ELECTRONIC DEVICES

This abstract first appeared for US patent application 19000339 titled 'CORE MODULES AND ELECTRONIC DEVICES

Original Abstract Submitted

A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, a vibration panel, and a face attachment component. The housing component includes a core housing and a core cover plate. The core cover plate is provided with a first avoidance hole allowing the vibration panel to be connected with the transducer device. The face attachment component covers the vibration panel. The core housing includes a cylindrical sidewall, an annular support, a plurality of buckle portions, a plurality of communication holes, and a plurality of columns. The core cover plate is supported on the annular support and plugged with the plurality of columns. The face attachment component snap-fits the plurality of buckle portions. The plurality of columns are arranged at intervals in a circumferential direction of the cylindrical sidewall.