18999446. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS (Tokyo Electron Limited)
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
Organization Name
Inventor(s)
Hajime Tamura of Kurokawa-gun JP
Yasuharu Sasaki of Kurokawa-gun JP
Shin Yamaguchi of Kurokawa-gun JP
Tsuguto Sugawara of Kurokawa-gun JP
Katsuyuki Koizumi of Kurokawa-gun JP
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
This abstract first appeared for US patent application 18999446 titled 'SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
Original Abstract Submitted
The disclosed substrate support includes a first region, a second region, a first electrode, and a second electrode. The first region is configured to hold a substrate placed thereon. The second region is provided to surround the first region and configured to hold an edge ring placed thereon. The first electrode is provided in the first region to receive a first electrical bias. The second electrode is provided in at least the second region to receive a second electrical bias. The second electrode extends below the first electrode to face the first electrode within the first region.