ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor(s)

Chih-Hsien Chiu of Taichung City TW

Ko-Wei Chang of Taichung City TW

Wen-Jung Tsai of Taichung City TW

Che-Wei Yu of Taichung City TW

Chia-Yang Chen of Taichung City TW

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 18990236 titled 'ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.