18989909. SUBSTRATE-STACKING STRUCTURE AND SUBSTRATE-CUTTING METHOD (SAMSUNG DISPLAY CO., LTD.)
SUBSTRATE-STACKING STRUCTURE AND SUBSTRATE-CUTTING METHOD
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SUBSTRATE-STACKING STRUCTURE AND SUBSTRATE-CUTTING METHOD
This abstract first appeared for US patent application 18989909 titled 'SUBSTRATE-STACKING STRUCTURE AND SUBSTRATE-CUTTING METHOD
Original Abstract Submitted
A substrate-cutting method includes preparing a first substrate in which a plurality of first active areas spaced apart from each other and a first non-active area surrounding the first active areas are defined in a plane, forming an adhesive layer on the first substrate where the adhesive layer is disposed within the first active areas, disposing a second substrate in which a plurality of second active areas spaced apart from each other and a second non-active area surrounding the second active areas are defined in the plane, and cutting a cutting line of the second substrate, which corresponds to a boundary between the second active areas and the second non-active area, using a laser beam. The adhesive layer does not overlap the cutting line of the second substrate.