RFID MODULE

Organization Name

Inventor(s)

RFID MODULE

This abstract first appeared for US patent application 18985394 titled 'RFID MODULE

Original Abstract Submitted

An RFID module is provided that includes a substrate having a first main surface and a second main surface, an RFIC chip disposed on the first main surface of the substrate, and a coil element having a conductive wire having a plurality of windings. A first end of the RFIC chip is electrically connected to a first end of the coil element. A second end of the RFIC chip is electrically connected to a second end of the coil element. The coil element has at least one sparsely wound portion, and both ends of the coil element are first densely wound portions in which the conductive wire is wound at a narrower pitch than the pitch in the sparsely wound portion.