Jump to content

18977548. DESCENDING ETCHING RESISTANCE IN ADVANCED SUBSTRATE PATTERNING (Applied Materials, Inc.)

From WikiPatents

DESCENDING ETCHING RESISTANCE IN ADVANCED SUBSTRATE PATTERNING

Organization Name

Applied Materials, Inc.

Inventor(s)

Chung-Chia Chen of Hsinchu City TW

Ji Young Choung of Hwaseong-si KR

Dieter Haas of Santa Clara CA US

Yu-Hsin Lin of Zhubei City TW

Jungmin Lee of Santa Clara CA US

Wen-Hao Wu of San Jose CA US

Si Kyoung Kim of Gwangju-si KR

DESCENDING ETCHING RESISTANCE IN ADVANCED SUBSTRATE PATTERNING

This abstract first appeared for US patent application 18977548 titled 'DESCENDING ETCHING RESISTANCE IN ADVANCED SUBSTRATE PATTERNING

Original Abstract Submitted

Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substrate, pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality of overhang structures. The first sub-pixel includes a first anode, OLED material, a first cathode, and a first encapsulation layer having a gap defined by a first portion of the first encapsulation layer disposed over the first cathode, a second portion of the first encapsulation layer disposed over a sidewall of the body structure, and a third portion of the first encapsulation layer under an underside surface of the top extension of the top structure, the first portion of the first encapsulation layer contacting the third portion of the first encapsulation layer.

Cookies help us deliver our services. By using our services, you agree to our use of cookies.