18976345. SUBSTRATE PROCESSING SYSTEM (Tokyo Electron Limited)
SUBSTRATE PROCESSING SYSTEM
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Inventor(s)
SUBSTRATE PROCESSING SYSTEM
This abstract first appeared for US patent application 18976345 titled 'SUBSTRATE PROCESSING SYSTEM
Original Abstract Submitted
A substrate processing system including a plasma processing apparatus including a processing container, a decompressed transferrer connected to the plasma processing apparatus, and a controller, a substrate support, a ring placing surface for receiving an edge ring, and an electrostatic chuck for electrostatically attracting the edge ring to the ring placing surface, a supply path for supplying a gas between a rear surface of the edge ring and the ring placing surface, and a pressure sensor connected to the supply path, the edge ring is placed on the ring placing surface, gas is supplied to the supply path to maintain a pressure in the supply path to be higher than a pressure in the processing container, the pressure in the supply path is measured by the pressure sensor to determine a placing state of the edge ring on the ring placing surface.
