18974912. PLATING MEMBRANE (Taiwan Semiconductor Manufacturing Co., Ltd.)
PLATING MEMBRANE
Organization Name
Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor(s)
Yung-Hsiang Chen of Tainan City TW
Hung-San Lu of Kaohsiung City TW
Chuang Chihchous of Fongshan City TW
Yu-Lung Yeh of Kaohsiung City TW
PLATING MEMBRANE
This abstract first appeared for US patent application 18974912 titled 'PLATING MEMBRANE
Original Abstract Submitted
A plating membrane includes a support structure extending radially outward from a nozzle that is to direct a flow of a plating solution toward a wafer. The plating membrane also includes a frame, supported by the support structure, having an inner wall that is angled outward from the nozzle. The outward angle of the inner wall relative to the nozzle directs a flow of plating solution from the nozzle in a manner that increases uniformity of the flow of the plating solution toward the wafer, reduces the amount of plating solution that is redirected inward toward the center of the plating membrane, reduces plating material voids in trenches of the wafer (e.g., high aspect ratio trenches), and/or the like.