18974377. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEONG-HOON Bae of Cheonan-si KR
ATSUSHI Fujisaki of Seongnam-si KR
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 18974377 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
A semiconductor package may include a redistribution substrate, a semiconductor chip mounted on a top surface of the redistribution substrate, and a conductive terminal provided on a bottom surface of the redistribution substrate. The redistribution substrate may include an under-bump pattern including a via portion in contact with the conductive terminal and a wire portion on the via portion and an insulating layer covering top and side surfaces of the under-bump pattern. A central portion of a bottom surface of the via portion may be provided at a level higher than an edge portion of the bottom surface of the via portion.