18971729. SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION (Rohm Co., Ltd.)
SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION
Organization Name
Inventor(s)
Masahiko Kobayakawa of Kyoto-shi JP
SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION
This abstract first appeared for US patent application 18971729 titled 'SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION
Original Abstract Submitted
A semiconductor device includes a lead frame, a semiconductor element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region.
