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18970445. ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PREVENTION FEATURES (Applied Materials, Inc.)

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ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PREVENTION FEATURES

Organization Name

Applied Materials, Inc.

Inventor(s)

Kwan Wook Roh of Kalispell MT US

Xundong Dai of Singapore SG

Keith Edward Ypma of Kalispell MT US

Scott A. Wehrmann of Columbia Falls MT US

ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PREVENTION FEATURES

This abstract first appeared for US patent application 18970445 titled 'ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PREVENTION FEATURES

Original Abstract Submitted

Electrochemical deposition systems and methods are described that have enhanced crystallization prevention features. The systems may include a bath vessel operable to hold an electrochemical deposition fluid having a metal salt dissolved in water. The systems may also include sensors including a thermometer and concentration sensor operable to measure characteristics of the electrochemical deposition fluid. The systems further include a computer configured to perform operations that include receiving system data from the electrochemical system and generating a control signal to change a characteristic of the electrochemical deposition fluid to prevent crystallization of a metal salt in the fluid. The computer generates the control signal based on processing that may include comparing an actual metal salt concentration in the electrochemical deposition fluid to a theoretical solubility limit for the metal salt in the fluid.

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