18969254. BONDED BODY AND CERAMIC CIRCUIT BOARD USING SAME (KABUSHIKI KAISHA TOSHIBA)
BONDED BODY AND CERAMIC CIRCUIT BOARD USING SAME
Organization Name
Inventor(s)
Sachiko Fujisawa of Kawasaki JP
Seiichi Suenaga of Yokohama JP
BONDED BODY AND CERAMIC CIRCUIT BOARD USING SAME
This abstract first appeared for US patent application 18969254 titled 'BONDED BODY AND CERAMIC CIRCUIT BOARD USING SAME
Original Abstract Submitted
A bonded body according to an embodiment includes a nitride ceramic member, and a metal member bonded with the nitride ceramic member via a bonding layer. A titanium nitride layer that includes titanium nitride as a major component is formed at a nitride ceramic member and the interface between the bonding layer. The titanium nitride layer includes a location at which an oxygen amount is not less than 1 at %.