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18969201. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME (UNITED MICROELECTRONICS CORP.)

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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Organization Name

UNITED MICROELECTRONICS CORP.

Inventor(s)

Wen-Wen Zhang of Changhua County TW

Kun-Chen Ho of Tainan City TW

Chun-Lung Chen of Tainan City TW

Chung-Yi Chiu of Tainan City TW

Ming-Chou Lu of Pingtung County TW

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

This abstract first appeared for US patent application 18969201 titled 'SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Original Abstract Submitted

A semiconductor device includes a gate structure on a substrate, a source/drain region adjacent to the gate structure, an interlayer dielectric (ILD) layer around the gate structure, a contact plug in the ILD layer and adjacent to the gate structure, an air gap around the contact plug, a barrier layer on and sealing the air gap, a metal layer on the barrier layer, a stop layer adjacent to the barrier layer and on the ILD layer, and an inter-metal dielectric (IMD) layer on the ILD layer. Preferably, bottom surfaces of the barrier layer and the stop layer are coplanar and top surfaces of the IMD layer and the barrier layer are coplanar.

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