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18969191. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME (UNITED MICROELECTRONICS CORP.)

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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Organization Name

UNITED MICROELECTRONICS CORP.

Inventor(s)

Wen-Wen Zhang of Changhua County TW

Kun-Chen Ho of Tainan City TW

Chun-Lung Chen of Tainan City TW

Chung-Yi Chiu of Tainan City TW

Ming-Chou Lu of Pingtung County TW

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

This abstract first appeared for US patent application 18969191 titled 'SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Original Abstract Submitted

A method for fabricating a semiconductor device includes the steps of forming a gate structure on a substrate, forming an interlayer dielectric (ILD) layer on the gate structure, forming a contact hole in the ILD layer adjacent to the gate structure, performing a plasma doping process to form a doped layer in the ILD layer and a source/drain region adjacent to the gate structure, forming a conductive layer in the contact hole, planarizing the conductive layer to form a contact plug, removing the doped layer to form an air gap adjacent to the contact plug, and then forming a stop layer on the ILD layer and the contact plug.

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