MODULE TRAY FOR SEMICONDUCTOR DEVICE

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MODULE TRAY FOR SEMICONDUCTOR DEVICE

This abstract first appeared for US patent application 18962104 titled 'MODULE TRAY FOR SEMICONDUCTOR DEVICE

Original Abstract Submitted

A module tray for a semiconductor device includes a base plate, first and second sidewalls extending in a vertical direction from opposite sides of the base plate to define an accommodation space, a dividing wall extending in the vertical direction from the base plate between the first and second sidewalls, first to fourth fastening guides with first to fourth fastening grooves, respectively, on inner surfaces of the first and second sidewalls and opposite side surfaces of the dividing wall, and first to fourth guide grooves on the inner surfaces of the first and second sidewalls and the opposite side surfaces of the dividing wall, respectively, the first to fourth guide grooves having curved concave shapes, and an upper end portion of each of the first to fourth fastening grooves gradually widening toward a top thereof.