18956271. SCAN TESTABLE THROUGH SILICON VIAS (TEXAS INSTRUMENTS INCORPORATED)
SCAN TESTABLE THROUGH SILICON VIAS
Organization Name
TEXAS INSTRUMENTS INCORPORATED
Inventor(s)
Lee D. Whetsel of Parker TX (US)
SCAN TESTABLE THROUGH SILICON VIAS
This abstract first appeared for US patent application 18956271 titled 'SCAN TESTABLE THROUGH SILICON VIAS
Original Abstract Submitted
The disclosure describes a novel method and apparatus for testing different types of TSVs in a single die or different types of TSV connections in a stack of die. The testing is facilitated by test circuitry associated with each type of TSV. The test circuitry includes a scan cell adapted for testing TSVs.
