SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Wei-Chih Lai of Hsinchu City (TW)

Chien-Chia Chiu of Taoyuan City (TW)

Chen-Hua Yu of Hsinchu City (TW)

Der-Chyang Yeh of Hsin-Chu (TW)

Cheng-Hsien Hsieh of Kaohsiung City (TW)

Li-Han Hsu of Hsin-Chu City (TW)

Tsung-Shu Lin of New Taipei City (TW)

Wei-Cheng Wu of Hsinchu City (TW)

Yu-Chen Hsu of Hsinchu (TW)

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 18955994 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

A semiconductor package includes a circuit substrate, a die, a frame structure, and a heat sink lid. The die is disposed on the circuit substrate and electrically connected with the circuit substrate. The die includes two first dies disposed side by side and separate from each other with a gap between two facing sidewalls of the two first dies. The frame structure is disposed on the circuit substrate and surrounding the die. The heat sink lid is disposed on the die and the frame structure. The head sink lid has a slit that penetrates through the heat sink lid in a thickness direction and exposes the gap between the two facing sidewalls of the two first dies.