SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Organization Name

Taiwan Semiconductor Manufacturing Company, LTD.

Inventor(s)

Wensen Hung of Hsinchu County (TW)

Ping-Kang Huang of Chiayi City (TW)

Sao-Ling Chiu of Hsinchu (TW)

Tsung-Yu Chen of Hsinchu City (TW)

Tsung-Shu Lin of New Taipei City (TW)

Chien-Yuan Huang of Hsinchu (TW)

Chen-Hsiang Lao of New Taipei City (TW)

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

This abstract first appeared for US patent application 18946959 titled 'SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Original Abstract Submitted

A semiconductor structure includes a circuit substrate, a semiconductor die, and a cover. The semiconductor die is disposed on the circuit substrate. The cover is disposed over the semiconductor die and over the circuit substrate. The cover comprises a lid portion and a support portion. The structure includes a first adhesive bonding the support portion to the circuit substrate and a second adhesive bonding the support portion and the lid portion.