RADIO FREQUENCY MODULE

Organization Name

Inventor(s)

RADIO FREQUENCY MODULE

This abstract first appeared for US patent application 18945956 titled 'RADIO FREQUENCY MODULE

Original Abstract Submitted

Provided is a radio frequency module which may not only reduce the height of the overall module but also ensure a sufficient degree of planarity as well. In a radio frequency module, a first electronic component is disposed on a wiring board. A second electronic component is built in the wiring board. A core board has a through hole. The first electronic component is arranged on a first buildup layer to overlap with the through hole of the core board when viewed in plan in a thickness direction defined for the core board. The second electronic component is disposed inside the through hole of the core board. Thickness of the second electronic component is greater than thickness of the core board when measured in the thickness direction defined for the core board. The second electronic component is electrically connected to the first electronic component via the first buildup layer.