18945942. Method of Fabricating Redistribution Circuit Structure (Taiwan Semiconductor Manufacturing Company, LTD.)
Method of Fabricating Redistribution Circuit Structure
Organization Name
Taiwan Semiconductor Manufacturing Company, LTD.
Inventor(s)
Method of Fabricating Redistribution Circuit Structure
This abstract first appeared for US patent application 18945942 titled 'Method of Fabricating Redistribution Circuit Structure
Original Abstract Submitted
A method of fabricating a redistribution circuit structure including the following steps is provided. A conductive via is formed. A photosensitive dielectric layer is formed to cover the conductive via. The photosensitive dielectric layer is partially removed to reveal the conductive via at least through an exposure and development process. A redistribution wiring is formed on the photosensitive dielectric layer and the revealed conductive via.