18941471. SUBSTRATE AND MODULE (Murata Manufacturing Co., Ltd.)

SUBSTRATE AND MODULE

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Ryuichi Kubo of Kyoto (JP)

SUBSTRATE AND MODULE

This abstract first appeared for US patent application 18941471 titled 'SUBSTRATE AND MODULE

Original Abstract Submitted

A substrate includes a core substrate that has a first surface, a second surface facing away from the first surface, and a cavity portion therein, an electronic component and a metal post that are provided in the single cavity portion, and an encapsulating material that fills the cavity portion and has a third surface close to the first surface and a fourth surface close to the second surface, in which the metal post is exposed through a third surface and a fourth surface of the encapsulating material.