18939420. APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING (SKYWORKS SOLUTIONS, INC.)
APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING
Organization Name
Inventor(s)
Aldrin Quinones Garing of Mexicali MX
APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING
This abstract first appeared for US patent application 18939420 titled 'APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING
Original Abstract Submitted
Apparatus and method for tool mark free stich bonding. In some embodiments, a method for wire bonding can include feeding a wire through a capillary tip and attaching a first end of the wire to a first location, thereby forming a ball bond. The method can further include moving the capillary tip towards a second location while the wire feeds out of the capillary tip. The method can further include attaching a second end of the wire to the second location while preventing contact between the capillary tip and the second location, thereby forming a stitch bond without a tool mark at the second location.