18938549. SiC EPITAXIAL WAFER (Resonac Corporation)

SiC EPITAXIAL WAFER

Organization Name

Resonac Corporation

Inventor(s)

Yoshikazu Umeta of Tokyo JP

SiC EPITAXIAL WAFER

This abstract first appeared for US patent application 18938549 titled 'SiC EPITAXIAL WAFER

Original Abstract Submitted

An objective of the present invention is to provide a SiC epitaxial wafer with a large diameter, a thin thickness, and few triangular defects. A SiC epitaxial wafer includes a SiC substrate and a SiC epitaxial layer. The SiC substrate has a diameter of 195 mm or more and a thickness of 460 μm or less. The SiC epitaxial layer has a triangular defect density of 0.2 pieces/cmor less.