18933246. INTEGRATED DEVICE PACKAGE WITH REDUCED THICKNESS (SKYWORKS SOLUTIONS, INC.)
INTEGRATED DEVICE PACKAGE WITH REDUCED THICKNESS
Organization Name
Inventor(s)
Alan Sangone Chen of Leesburg FL US
Sundeep Nand Nangalia of Raleigh NC US
INTEGRATED DEVICE PACKAGE WITH REDUCED THICKNESS
This abstract first appeared for US patent application 18933246 titled 'INTEGRATED DEVICE PACKAGE WITH REDUCED THICKNESS
Original Abstract Submitted
An integrated device package is disclosed. The integrated device package can include an integrated device die that is mounted to a carrier. The integrated device die has a bottom side facing the carrier and a top side opposite the bottom side. The integrated device package can include a cavity that is located between the bottom side of the integrated device die and the carrier, a cavity seal that at least partially seals the cavity, and a molding material that is disposed about the integrated device die. The integrated device die can be an acoustic wave filter.