Jump to content

18931457. Injection Molding Device (SEIKO EPSON CORPORATION)

From WikiPatents


Injection Molding Device

Organization Name

SEIKO EPSON CORPORATION

Inventor(s)

Hiroki Takano of Matsumoto JP

Seijun Horie of Matsumoto JP

Injection Molding Device

This abstract first appeared for US patent application 18931457 titled 'Injection Molding Device

Original Abstract Submitted

The injection molding device includes a plasticization section generating a molding material; a fixed section to which an injection mold, in which is formed a cavity, is detachably attachable, the injection mold including a first mold and a second mold; and a nozzle, wherein the second mold includes a third mold and a fourth mold arranged between the first mold and the third mold in a mold opening direction of the second mold, the cavity is formed by the third mold and the fourth mold, a passage is formed in the fourth mold, the third mold includes a first cooling section for cooling the third mold, the fourth mold includes a second cooling section for cooling the fourth mold, and a first cooling capacity of the first cooling section is different from a second cooling capacity of the second cooling section.

Cookies help us deliver our services. By using our services, you agree to our use of cookies.