18928578. HIGH THROUGHPUT SUBSTRATE PROCESSING CLUSTER TOOL (Applied Materials, Inc.)
HIGH THROUGHPUT SUBSTRATE PROCESSING CLUSTER TOOL
Organization Name
Inventor(s)
Upendra Ummethala of Santa Clara CA US
Kaushik Alayavalli of Sunnyvale CA US
Ralph Lindenberg of Büdingen-Rinderbügen DE
Tuan Anh Nguyen of San Jose CA US
Amit Hattangadi of Karnataka IN
HIGH THROUGHPUT SUBSTRATE PROCESSING CLUSTER TOOL
This abstract first appeared for US patent application 18928578 titled 'HIGH THROUGHPUT SUBSTRATE PROCESSING CLUSTER TOOL
Original Abstract Submitted
A cluster tool for fabricating substrates includes a factory interface; a first processing mainframe coupled to the factory interface, including: a processing chamber monolithic structure including four processing chambers in the same housing; four load locks coupled to the processing chamber monolithic structure, each load lock including a heater assembly configured to increase the temperature of a substrate disposed in the load lock; and a swapper assembly disposed between the four load locks and the processing chamber monolithic structure, wherein the swapper assembly includes four swappers, each swapper configured to swap substrates between one processing chamber and one load lock along a linear trajectory.