18925607. YIELD IMPROVEMENTS IN STACKED PACKAGING (KLA Corporation)

YIELD IMPROVEMENTS IN STACKED PACKAGING

Organization Name

KLA Corporation

Inventor(s)

Xuewen Wang of Shanghai CN

YIELD IMPROVEMENTS IN STACKED PACKAGING

This abstract first appeared for US patent application 18925607 titled 'YIELD IMPROVEMENTS IN STACKED PACKAGING

Original Abstract Submitted

Shape-changed induced stress for a target thickness of a bonded wafer can be determined. A bonding strength for the bonded wafer can then be determined using the shape-changed induced stress. Bonding parameters can be determined for the bonding strength. The bonding strength that is determined can be compared with an inline bonding strength for formation of the bonded wafer.