18904478. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING DEVICE (STMicroelectronics International N.V.)
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING DEVICE
Organization Name
STMicroelectronics International N.V.
Inventor(s)
Claudio Zafferoni of Milano IT
Antonio Bellizzi of Cologno Monzese IT
Alessandro Mellina Gottardo of Milano IT
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING DEVICE
This abstract first appeared for US patent application 18904478 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING DEVICE
Original Abstract Submitted
A semiconductor chip is covered by a non-LDS encapsulation material (i.e., encapsulation material not including LDS-activatable additives). One or more first pathways are opened towards the semiconductor chip through the non-LDS encapsulation material. LDS encapsulation material (i.e., encapsulation material including LDS-activatable additives) is molded over the non-LDS encapsulation material to fill the first pathways. One or more second pathways, aligned with the first pathways, are opened towards the semiconductor chip through the LDS encapsulation material. The second pathways have an inner lining of LDS encapsulation material. Electrical coupling formations for the semiconductor chip are provided via laser direct structuring processing of the LDS encapsulation material including the inner lining in the second pathways.