18903375. EDGE TRIMMING METHOD AND EDGE TRIMMING APPARATUS (DISCO CORPORATION)

EDGE TRIMMING METHOD AND EDGE TRIMMING APPARATUS

Organization Name

DISCO CORPORATION

Inventor(s)

Kensuke Furuta of Tokyo JP

EDGE TRIMMING METHOD AND EDGE TRIMMING APPARATUS

This abstract first appeared for US patent application 18903375 titled 'EDGE TRIMMING METHOD AND EDGE TRIMMING APPARATUS

Original Abstract Submitted

An edge trimming method for removing a chamfered portion on an outer periphery of a grinding-object wafer in a bonded wafer is provided. The method includes a holding process to hold the bonded wafer on a chuck table, a finishing-grindstone mark forming process to form a finishing-grindstone mark in the grinding-object wafer with the finishing grindstone, a finishing-grindstone mark height measuring process to measure a height of a bottom of the finishing-grindstone mark with a height measurer, a finishing-grindstone height calculating process to calculate a height of the finishing grindstone based on the measured height of the bottom, a rough-grinding process to lower the rough grindstone and rotate the bonded wafer to roughly grind the grinding-object wafer with the rough grindstone, and a finish-grinding process to lower the finishing grindstone to the calculated height and rotate the bonded wafer to finely grind the grinding-object wafer with the finishing grindstone.