18902997. Packaging electronic device with liquid thermal interface material (Marvell Asia Pte Ltd)
Packaging electronic device with liquid thermal interface material
Organization Name
Inventor(s)
Janak Patel of South Burlington VT US
Assaad El Helou of Los Angeles CA US
Packaging electronic device with liquid thermal interface material
This abstract first appeared for US patent application 18902997 titled 'Packaging electronic device with liquid thermal interface material
Original Abstract Submitted
An electronic device includes (i) an integrated circuit (IC) die mounted on a substrate, (ii) a lid having first and second surfaces facing one another, and one or more openings formed through the lid between the first and second surfaces, the lid being disposed over at least the IC die to form a space between the IC die and the first surface of the lid, the one or more openings are configured to enable transference of fluids through the lid, (iii) a liquid thermal interface material (TIM) filling the space and being formulated to conduct heat from the IC die to the lid, and (iv) a stopper structure extended from the first surface of the lid, the stopper structure includes one or more sidewalls configured to contain the liquid TIM at least in the space between the IC die and the first surface of the lid.