18899327. 3D Memory Mold Film Stack (Applied Materials, Inc.)
3D Memory Mold Film Stack
Organization Name
Inventor(s)
Ruiying Hao of Santa Clara CA US
Fredrick David Fishburn of Aptos CA US
Raghuveer Satya Makala of Campbell CA US
Thomas John Kirschenheiter of Tempe AZ US
Balasubramanian Pranatharthiharan of San Jose CA US
3D Memory Mold Film Stack
This abstract first appeared for US patent application 18899327 titled '3D Memory Mold Film Stack
Original Abstract Submitted
Three-dimensional (3D) memory structures and methods of formation of same are provided herein. In some embodiments, a 3D memory fabrication structure includes: a base silicon (Si) layer; a silicon germanium (SiGe) layer disposed above the base Si layer; and a doped silicon (Si) layer disposed on at least one side of the SiGe layer, wherein the doped Si layer contains a dopant that is at least one of carbon (C) or boron (B).