18897181. METHOD OF AND INTERMEDIATE FOR MANUFACTURING A SEMICONDUCTOR DIE PACKAGE (NEXPERIA B.V.)
METHOD OF AND INTERMEDIATE FOR MANUFACTURING A SEMICONDUCTOR DIE PACKAGE
Organization Name
Inventor(s)
Shun Tik Yeung of Hong Kong HK
METHOD OF AND INTERMEDIATE FOR MANUFACTURING A SEMICONDUCTOR DIE PACKAGE
This abstract first appeared for US patent application 18897181 titled 'METHOD OF AND INTERMEDIATE FOR MANUFACTURING A SEMICONDUCTOR DIE PACKAGE
Original Abstract Submitted
There is provided a method of manufacturing a semiconductor die package. The method includes providing a leadframe having a sub-structure and at least one tie bar, the sub-structure includes a terminal-forming portion in electrical communication with the at least one tie bar. The method includes bonding a die to the sub-structure. The method includes encapsulating the sub-structure and the die within an encapsulation layer. The method includes performing a first cut through the terminal-forming portion and the encapsulation layer so as to form a side terminal, while leaving all tie bars substantially intact. The method includes electroplating the side terminal. The method includes performing a second cut through the tie bar and the encapsulation layer to singulate a semiconductor die package from the leadframe.