18890823. MULTILAYER CERAMIC ELECTRONIC COMPONENT AND ASSEMBLY (NGK INSULATORS, LTD.)
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND ASSEMBLY
Organization Name
Inventor(s)
Akifumi Morishita of Komaki-shi (JP)
Tomohiko Hibino of Inazawa-shi (JP)
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND ASSEMBLY
This abstract first appeared for US patent application 18890823 titled 'MULTILAYER CERAMIC ELECTRONIC COMPONENT AND ASSEMBLY
Original Abstract Submitted
A first side surface electrode connects a first external electrode layer to the second internal electrode layer on the first side surface, and is separated from the first internal electrode layer. A second side surface electrode connects the second external electrode layer to the first internal electrode layer on the second side surface, and is separated from the second internal electrode layer. In a two-dimensional layout, all of the following regions overlap each other in a portion higher than or equal to 75% of a region in which the piezoelectric ceramic part is disposed: a region in which the first external electrode layer and the first internal electrode layer overlap each other; a region in which the first internal electrode layer and the second internal electrode layer overlap each other; and a region in which the second external electrode layer and the second internal electrode layer overlap each other.