18888294. INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THEREOF (NEXPERIA B.V.)
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THEREOF
Organization Name
Inventor(s)
Ricardo Yandoc of Manchester GB
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THEREOF
This abstract first appeared for US patent application 18888294 titled 'INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THEREOF
Original Abstract Submitted
An integrated circuit package is provided, including: a die having circuitry with one or more bond pads on a first surface of the die; a conductive supporting structure allowing connection to the die, the conductive supporting structure including a slot; and a passive component inserted into the slot of the conductive support structure, and a first terminal of the passive component is electrically connected to the conductive supporting structure and the circuitry of the die.
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